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  1. CLR 1180 / CLH 6020

    A low viscosity, two component, unfilled, room temperature cure, epoxy system. This system provides resiliency and strength making it suitable for a variety of applications. ie. adhesives, castings, coatings and tooling. CLR 1180 / CLH 6020

  2. CLR 1180 / CLH 6520

    Flexible epoxy casting and potting system. An unfilled, semi-flexible epoxy casting system with long pot life. This product may be used in large mass casting. CLR 1180 / CLH 6520

  3. CLR 1180 / CLH 6560

    Room temp cure, Excellent shock resistance. An exceptional epoxy casting system with excellent thermal and mechanical shock resistance. CLR 1180 / CLH 6560

  4. CLR 1180 / CLH 6770

    A two component, unfilled, room temperature cure epoxy, for coating, casting, and adhesive applications. CLR 1180 / CLH 6770

  5. CLR 1180 / CLH 6930

    Room temp cure, excellent shock resistance. An exceptional epoxy laminating system with excellent thermal and mechanical shock resistance. Product is suitable for a variety of applications. CLR 1180 / CLH 6930

  6. CLR 1183 / CLH 6560

    Shock resistant, General purpose epoxy. A two component epoxy casting system. product has low shrinkage and excellent shock resistance. CLR 1183 / CLH 6560

  7. CLR 1190 / CLH 6025

    General purpose variable substrate adhesive. A medium viscosity, unfilled casting system. It is suitable for large mass castings and exhibits good impact resistance. CLR 1190 / CLH 6025

  8. CLR 1190 / CLH 6140

    General purpose variable substrate adhesive. A two component room temperature curing epoxy system. Product is suitable for potting, adhesive, and coating applications. Product meets the food and drug administration (FDA) regulations permitting use in food contact applications. CLR 1190 / CLH 6140

  9. CLR 1190 / CLH 6372

    Solvent resistant. Good Adhesive. A room temperature cure casting system with excellent chemical resistance. When properly post cured, the product is suited for operation at elevated temperatures. CLR 1190 / CLH 6372

  10. CLR 1296 / XHD 1303

    A low viscosity, aluminum filled, room temperature gelling casting system. Product has excellent surface reproduction and high strength. This system is recommended for use with aluminum shot for large mass casting. The product may be cast up to 2 inches in depth. CLR 1296 / XHD 1303

  11. CLR 1299 / CLH 6330

    General Purpose Aluminum. An aluminum filled, low viscosity, room temperature gelling, casting system. The product has excellent surface reproduction, and high strength. This system is recommended for use with aluminum shot for large mass casting. CLR 1299 / CLH 6330

  12. CLR 1299 / XHD 1303

    General Purpose Aluminum. An aluminum filled, low viscosity, room temperature gelling, casting system. The product has excellent surface reproduction, and high strength. This system is recommended for use with aluminum shot for large mass casting. CLR 1299 / XHD 1303

  13. CLR 1796 / CLH 6580

    UL 94-V0 system for potting and casting small electronic parts that require thermal shock and thermal cycling performance. A two component, low viscosity, room temperature cure epoxy system. Material has yellow card UL94-V0 rating, and contains non abrasive fillers suitable for meter mix dispense. CLR 1796 / CLH 6580

  14. CLS 9600

    High Temperature. A single component, 100% solids, low viscosity, impregnating compound for coils and transformers. This product is also suitable for sand casting. CLS 9600

  15. CLS 9611

    A low viscosity, single component, epoxy potting and encapsulating compound. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL 94-HB flammability requirements. Heat Cure Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. CLS 9611

  16. CLS 9616

    Heat Cure. Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. Low viscosity. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL94-HB flammability requirements. CLS 9616

  17. XRD 1014 / XHD 1015

    High temperature clear epoxy. An unfilled, heat resistant, clear laminating system. Products low viscosity gives the system excellent wet-out properties to fibreglass and other reinforcing fibres. The material exhibits high physical strengths and modulus with moderate post cure temperatures. XRD 1014 / XHD 1015

  18. XRD 1018 / XHD 1019

    1:1 Mix Ratio, 130°C Operating, General Purpose, Low cost. A two component, room temperature cure semi-flexible, flame retardant, epoxy system. The system was developed for potting/casting of electrical and electronic components. Its use of non-abrasive fillers and convenient 1 to 1 ratio by volume, make it ideal for use in machine dispensing equipment. This product meets UL94-V0 in house flammability testing. XRD 1018 / XHD 1019

  19. XRD 1116 / XHD 1117

    Room Temperature Cure Epoxy system suitable for potting and casting electrical / electronic components. 2:1 machine dispense friendly mix. Suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing. XRD 1116 / XHD 1117

  20. XRD 1116 / XHD 1158

    2:1 machine dispense friendly mix. A filled, room temperature cure, two component epoxy system. The product is suitable for potting / encapsulating electrical and electronic components. The use of non-abrasive fillers and the convenient mix ratio makes it suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing. XRD 1116 / XHD 1158

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